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Vertiv

TOP PANEL TWO 550 CFM FANS 1100 CFM

Out of Stock

Vertiv TPE-242F10-230 Top Panel 2x550 CFM Fans | Rack Cooling

Vertiv

MPN: TPE-242F10-230

$866.21$1,256.00
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Key Features

  • Two-fan cooling assembly
  • 550 CFM airflow per fan
  • 1,100 CFM total airflow
  • Top-panel rack mounting
  • Vertiv TPE-242F10-230 MPN
  • High-capacity enclosure exhaust design
  • Move heat out of dense enclosures with 1,100 CFM total airflow
  • Support stable rack temperatures using two 550 CFM fans
When rack density rises, airflow has to keep pace. Vertiv TPE-242F10-230 is a top-panel fan assembly designed to support strong exhaust at the highest point of the enclosure, where hot air collects. With two 550 CFM fans delivering 1,100 CFM total airflow, it is built for installations that need more than basic ventilation. This kind of targeted cooling matters in cabinets carrying high-load network, storage, or compute equipment. By helping pull warm air out of the rack, the panel supports more consistent internal temperatures and reduces the burden on surrounding cooling infrastructure. That makes it a practical choice for teams managing thermal constraints in enclosed or high-density environments. The value here is not just airflow volume. It is the ability to direct that airflow where it has the most effect. For infrastructure teams, that means a cleaner thermal strategy for racks that cannot afford heat buildup. In demanding deployments, a high-capacity top-panel fan assembly can help preserve performance, reduce thermal stress, and support uptime without overcomplicating the cooling design.

Ideal For

  • Cooling high-density server racks in data rooms
  • Exhausting hot air from enclosed network cabinets
  • Supporting airflow in storage-heavy rack deployments
  • Adding top-mounted ventilation to thermal-constrained enclosures

Why This Product

  • 11,100 CFM total airflow for stronger heat removal than lower-output panels
  • 2Two 550 CFM fans balance high airflow with focused enclosure exhaust
  • 3Top-panel design targets the hottest point in the rack
  • 4Built for dense deployments where thermal headroom is limited