Vertiv
3T CEILING MOUNTED W/ CONDENSER MT036/PFD037
Out of Stock
Vertiv Q03106217-04 3T Ceiling Mounted w/ Condenser | In-Row Cooling
Vertiv
MPN: Q03106217-04
$14,328.95
Free shipping on orders over $500
Authorized Dealer — Full manufacturer warranty
Key Features
- Vertiv Q03106217-04
- 3T ceiling mounted configuration
- Condenser MT036/PFD037
- In-row cooling system
- Ceiling-mounted installation
- Targeted heat removal architecture
- Stabilize rack inlet temperatures with targeted in-row heat removal
- Preserve floor space using a ceiling-mounted cooling configuration
Keep critical infrastructure within thermal limits with a ceiling-mounted in-row cooling configuration built for targeted heat removal. The Vertiv Q03106217-04 is specified as a 3T ceiling mounted unit with condenser MT036/PFD037, making it suited to environments where rack density, airflow control, and floor-space efficiency all matter.
By moving cooling closer to the heat source, this configuration helps reduce hot spots and supports more consistent inlet temperatures across the row. That matters in rooms where traditional perimeter cooling leaves gaps or forces overprovisioning. Ceiling mounting also preserves valuable white space for cabinets, cabling, and service access.
This model is a fit for teams planning around constrained layouts, predictable thermal loads, and infrastructure that cannot tolerate temperature swings. It is the kind of cooling architecture chosen when uptime, placement flexibility, and localized heat removal are worth more than a generic room-level approach.
Ideal For
- Cooling dense server rows in space-constrained data rooms
- Supporting thermal control in retrofit IT environments
- Managing localized heat loads near high-density racks
- Preserving floor space in facilities with limited white space
Why This Product
- 1Ceiling-mounted design preserves floor space
- 2Targeted cooling is better suited to dense rows than room-level systems
- 3Condenser pairing supports localized heat removal
- 4Purpose-built for infrastructure where thermal consistency matters